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[TMF Implementation Case] Integrated Circuit Assembly Factory (Suzhou, China)

Essential treatment for the recycling and reuse of industrial wastewater! Introduction of TMF application cases.

Backgrinding and dicing are processes in the manufacturing of integrated circuits (ICs). In these processes, ultra-pure water is used to wash away fine silica particles and other substances that adhere to the wafers, resulting in industrial wastewater that is discharged. Typically, this wastewater contains ultra-pure water mixed with fine silica particles, but sometimes grinding fluid may also be present. The removal of these fine silica particles is an essential treatment for the recycling and reuse of this large volume of industrial wastewater. We will verify that the introduction of this system is a suitable choice for the facility. [Installation Site] ■ An integrated circuit assembly factory located in Suzhou, China *For more details, please refer to the PDF document or feel free to contact us.

• Company：アクアテクノロジー 環境事業部
• Price：Other

• Water Treatment
• Sanitary fixtures
• Water treatment technology and systems